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CG MATERIAL

Tungsten Copper Alloy, WCu

Tungsten Copper Alloy, WCu

Tungsten Copper (WCu) is a composite material consisting of tungsten (W) and copper (Cu), typically containing 70-90% tungsten by weight. It has a high thermal conductivity, high strength, and good electrical conductivity, making it suitable for a variety of applications in electronics, aerospace, and other industries.

WCu is commonly used in electrical contacts, as its high thermal conductivity and low coefficient of thermal expansion help to dissipate heat and minimize thermal stress. It is also used in heat sinks, where its high thermal conductivity and low density make it an effective material for dissipating heat in electronic devices.

In addition, WCu can be used in the aerospace industry for applications such as rocket nozzles, where its high strength and resistance to high temperatures make it suitable for use in extreme environments.

WCu is typically produced by powder metallurgy, where tungsten and copper powders are mixed together and then consolidated under high temperature and pressure. The resulting material can be further processed into various shapes and sizes, such as rods, plates, and tubes, to meet specific application requirements.


Tungsten Copper Alloy Properties (Theoretical)

Compound Formula WCu
Molecular Weight 247.39
Appearance Lumps, pieces, and granules
Melting Point N/A
Boiling Point N/A
Density 13-16 g/cm3
Solubility in H2O N/A
Exact Mass 246.880529
Monoisotopic Mass 246.880529


Materials Tungsten Copper Alloy
Purity 99.9% - 99.99%


Tungsten Copper Alloy Specifications

  • Surface: No coating, electroplated Ni, Ni-Au, or electroless Ni

  • Tungsten Copper Plate: 300mm x 300mm x 0.5-50mm, customized

  • Tungsten Copper Rod: 2-200mm dia. x L, customized

Tungsten Copper Alloy Composition and Properties

Composites

Nominal Composition
 (% Weight)

Density
(g/cm3, ≥)

Electrical Resistivity
 (20°C, µΩ·cm, ≤)

Electrical conductivity
 (IACS%, ≥)

Hardness(≥)
 Brinell Hardness

Bending Strength

Mpa

Kgf/mm2

Mpa

Kgf/mm2

CuW50

50% Copper
 50% Tungsten

11.85

3.2

54

1128

115

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---

CuW55

45% Copper
 55% Tungsten

12.3

3.5

49

1226

125

---

---

CuW60

40% Copper
 60% Tungsten

12.75

3.7

47

1373

140

---

---

CuW65

35% Copper
 65% Tungsten

13.3

3.9

44

1520

155

---

---

CuW70

30% Copper
 70% Tungsten

13.8

4.1

42

1716

175

667

68

CuW75

25% Copper
 75% Tungsten

14.5

4.5

38

1912

195

706

72

CuW80

20% Copper
 80% Tungsten

15.15

5.0

34

2158

220

736

75

CuW85

15% Copper
 85% Tungsten

15.9

5.7

30

2354

240

765

78

CuW90

10% Copper
 90% Tungsten

16.75

6.5

27

2550

260

804

82

We also provide Tungsten Carbide Copper and Tungsten Carbide Silver.

Tungsten Copper Alloy Applications

Tungsten copper heat sinks are extensively used as thermal mounting plates, chip carriers, flanges, and frames for RF and microwave packages, laser diode packages, and complex carriers for optoelectronics amplifiers, receivers, transmitters, tunable lasers, etc.

  • High-performance materials for aerospace
  • Vacuum contact material
  • Electrodes for EDM
  • Electronic packaging materials and heat sink materials
  • Heat Spreader Materials

Packaging

We handle our products with care to ensure they remain in their original condition during storage and transportation and to preserve their quality.

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