CG MATERIAL
Tantalum Sputtering Target
Tantalum Sputtering Target
A Tantalum sputtering target is a material used in physical vapor deposition (PVD) to deposit thin films of Tantalum onto a substrate. It is a high-purity Tantalum metal in the form of a disk or plate, often made through a powder metallurgy process. Tantalum sputtering targets are used in a wide range of applications, including in the semiconductor industry for the production of microchips, and in the manufacturing of optical and electronic devices. The quality of the Tantalum sputtering target is critical in determining the quality of the deposited films, and it is therefore essential that the target is of high purity and has the desired physical properties.
Tantalum Sputtering Target Properties (Theoretical)
| Molecular Weight | 180.94 |
|---|---|
| Appearance | Silvery-gray solid |
| Melting Point | 3017 °C |
| Boiling Point | 5458 °C |
| Density | 16.69 g/cm3 (20 °C) |
| Solubility in H2O | N/A |
| Crystal Phase / Structure | α: body-centered cubic (bcc) / β: tetragonal |
| Electrical Resistivity | 131 nΩ·m (20 °C) |
| Electronegativity | 1.5 Paulings |
| Heat of Fusion | 36.57 kJ/mol |
| Heat of Vaporization | 753 kJ/mol |
| Poisson's Ratio | 0.34 |
| Specific Heat | 140 J/kg·K |
| Thermal Conductivity | 57.5 W/m·K |
| Thermal Expansion | 6.3 µm/m·K |
| Vickers Hardness | 870–1200 MPa |
| Young's Modulus | 186 GPa |
Tantalum Sputtering Target Specifications
|
Part No. |
Material |
Size |
Purity |
|
CG-TA01 |
Tantalum |
1.00" Dia. x 0.125" Thick |
99.95% |
|
CG-TA02 |
Tantalum |
1.00" Dia. x 0.250" Thick |
99.95% |
|
CG-TA03 |
Tantalum |
2.00" Dia. x 0.125" Thick |
99.95% |
|
CG-TA04 |
Tantalum |
2.00" Dia. x 0.250" Thick |
99.95% |
|
CG-TA05 |
Tantalum |
3.00" Dia. x 0.250" Thick |
99.95% |
|
CG-TA06 |
Tantalum |
3.00" Dia. x 0.250" Thick |
99.95% |
|
CG-TA07 |
Tantalum |
4.00" Dia. x 0.250" Thick |
99.95% |
|
CG-TA08 |
Tantalum |
4.00" Dia. x 0.250" Thick |
99.95% |
|
CG-TA09 |
Tantalum |
5.00" Dia. x 0.250" Thick |
99.95% |
|
CG-TA10 |
Tantalum |
5.00" Dia. x 0.250" Thick |
99.95% |
Tantalum Sputtering Target Applications
• Used in laboratory equipment.
• Used as a substitute for platinum.
• Used in manufacturing superalloys and electron-beam melting.
• Used in metallurgical, machinery processing, glass, and ceramic industries.
• Used as a superalloy additive in nickel-based alloys.
• Used for sputtering targets in integrated circuits and Thin Film Transistor Liquid Crystal Display (TFT-LCD).
Packaging
We handle our products with care to ensure they remain in their original condition during storage and transportation and to preserve their quality.
