CG MATERIAL
Spherical Copper Powder for Additive Manufacturing
Spherical Copper Powder for Additive Manufacturing
Specifications
Chemical Formula | Cu |
CAS | 7440-50-8 |
Purity | 99.90% |
Particle Size | Customized between 100nm-200um |
Appearance | Red Brown powder |
Spherical Copper Powder is a type of metal powder characterized by its spherical particle shape, which provides unique properties suitable for various industrial applications. Its spherical geometry offers benefits in terms of flowability, packing density, and surface area. Below are the key details about Spherical Copper Powder:
Properties:
- Chemical Formula: Cu
- Appearance: Reddish-brown metallic powder
- Particle Shape: Spherical
- Purity: Typically over 99% pure copper (depending on the production method)
- Particle Size Range: Varies by application, ranging from a few micrometers to several hundred micrometers
- Density: 8.96 g/cm³
- Melting Point: 1,085°C
- Electrical Conductivity: High, which is characteristic of copper
- Thermal Conductivity: Excellent thermal conductor, used in heat dissipation applications
Production Methods:
Spherical copper powder can be produced through various techniques, including:
- Atomization: A common method where molten copper is atomized into fine droplets by using gas or water. The droplets solidify into spherical particles as they cool.
- Electrolytic Process: Involves the electrochemical reduction of copper ions into powder form, though less common for producing spherical particles.
- Mechanical Milling: Mechanical processes can also be used, but this often results in irregularly shaped particles.
Applications:
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3D Printing (Additive Manufacturing):
- Spherical copper powder is extensively used in metal 3D printing technologies like Selective Laser Melting (SLM) and Electron Beam Melting (EBM). The powder’s shape and flowability are critical for consistent powder layering during the printing process.
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Electronics and Conductive Materials:
- Due to its excellent electrical conductivity, spherical copper powder is used in the production of conductive pastes and inks for printed circuit boards (PCBs), semiconductors, and electronic components.
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Metallurgy and Powder Metallurgy:
- Copper powder is used to manufacture parts via powder metallurgy techniques, where the powder is compacted and then sintered to form solid components. Spherical powder is preferred due to its high packing density and uniform particle size distribution.
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Thermal Management:
- Spherical copper powder is used in thermal management applications, such as heat sinks, conductive fillers in composite materials, and conductive adhesives due to its high thermal conductivity.
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Surface Coatings and Spraying:
- In applications like thermal spraying and coating processes, spherical copper powder is used to apply a conductive or protective layer to surfaces. Its high flowability ensures even coating and smooth finishes.
Handling and Safety:
- Toxicity: Copper is generally considered safe in its metallic form, but inhalation of fine copper dust or fumes can lead to respiratory issues. Handling copper powder should be done in well-ventilated environments with protective equipment such as gloves and dust masks.
- Storage: Copper powder should be stored in a dry, airtight container to prevent oxidation, as exposure to air and moisture may lead to the formation of copper oxide on the powder surface.