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Hexagonal Boron Nitride Film (h-BN Film)

Hexagonal Boron Nitride Film (h-BN Film)

Hexagonal Boron Nitride (h-BN) Film is a thin layer of boron nitride with a hexagonal crystal structure, similar to graphene. h-BN film is a high-performance material with excellent thermal and electrical properties, making it ideal for various applications in electronics, optics, and aerospace industries.

The h-BN film can be deposited on a substrate by various methods, such as chemical vapor deposition, physical vapor deposition, and liquid-phase exfoliation. The thickness of h-BN film can vary from a few monolayers to tens of nanometers.

h-BN film exhibits excellent thermal conductivity and high electrical insulation, making it a suitable material for heat management and electrical insulation in high-temperature applications. It is also optically transparent in the visible and ultraviolet regions, making it useful for optical components such as lenses, windows, and mirrors.

h-BN film is also a good barrier material due to its low surface energy and chemical inertness. It can be used as a protective coating in harsh environments or as a barrier layer for various applications, including moisture and gas barriers.

Due to its unique properties, h-BN film finds applications in various fields, including microelectronics, optics, sensors, batteries, and aerospace.

Boron Nitride Ceramics Specification

CG Material production formulations are developed to address the varied application problems in which ceramic components are commonly used. Many industrial applications push the envelope on specific requirements leading to the development of new formulations to successfully address them.

Item No. Description Purity Lot Size
CG-NI05-98 Boron Nitride Powder
Particle Size: 3 µm, 200 mesh or 325mesh
BN > 98 %,
B2O3 < 0.6%,
Ca < 0.015%,
Si < 0.12%
100 kg
CG-NI05-99 Boron Nitride Powder
Particle Size: 3 µm, 200 mesh or 325mesh
BN > 99 %,
B2O3 < 0.4%,
Ca < 0.01%,
Si < 0.10%
100 kg

Comparison of Boron Nitride Ceramics

Compositions BN>98% BN+SiC+ZrO2 BN+AIN
Binder B2O3 / AlBO3
Density 2.1-2.2 g/cm3 2.3-3.0 g/cm3 2.5-2.6 g/cm3
25°C Volume Resistivity >1013 Ω·cm >1012 Ω·cm >1014 Ω·cm
Max. Service Temp. (°C)
Inert Gas;
High Vacuum










Flexural Strength 75 Mpa 100 Mpa 130 Mpa
Compressive Strength 100 Mpa 300 Mpa 250 Mpa
Coefficient of Thermal Expansion
2.0 x 10–6/K 4.0 x 10–6/K 4.5 x 10–6/K
Thermal Conductivity 30 W/mK 40 W/mK 60 W/mK


HBN Film Specification

Type Substrate: copper foil.
Size (mm) 5*10, 10*10, 10*20
Crystal Structure Hexagonal Phase
Method Chemical Vapor Deposition (CVD)

HBN Film Applications

* Plasma arc welding applications

* Semiconductor crystal growth equipment and processing


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