CG MATERIAL
Hexagonal Boron Nitride Film (h-BN Film)
Hexagonal Boron Nitride Film (h-BN Film)
Hexagonal Boron Nitride (h-BN) Film is a thin layer of boron nitride with a hexagonal crystal structure, similar to graphene. h-BN film is a high-performance material with excellent thermal and electrical properties, making it ideal for various applications in electronics, optics, and aerospace industries.
The h-BN film can be deposited on a substrate by various methods, such as chemical vapor deposition, physical vapor deposition, and liquid-phase exfoliation. The thickness of h-BN film can vary from a few monolayers to tens of nanometers.
h-BN film exhibits excellent thermal conductivity and high electrical insulation, making it a suitable material for heat management and electrical insulation in high-temperature applications. It is also optically transparent in the visible and ultraviolet regions, making it useful for optical components such as lenses, windows, and mirrors.
h-BN film is also a good barrier material due to its low surface energy and chemical inertness. It can be used as a protective coating in harsh environments or as a barrier layer for various applications, including moisture and gas barriers.
Due to its unique properties, h-BN film finds applications in various fields, including microelectronics, optics, sensors, batteries, and aerospace.
Boron Nitride Ceramics Specification
CG Material production formulations are developed to address the varied application problems in which ceramic components are commonly used. Many industrial applications push the envelope on specific requirements leading to the development of new formulations to successfully address them.
| Item No. | Description | Purity | Lot Size |
| CG-NI05-98 | Boron Nitride Powder Particle Size: 3 µm, 200 mesh or 325mesh |
BN > 98 %， B2O3 < 0.6%, Ca < 0.015%, Si < 0.12% |
100 kg 1000kg Customize |
| CG-NI05-99 | Boron Nitride Powder Particle Size: 3 µm, 200 mesh or 325mesh |
BN > 99 %， B2O3 < 0.4%, Ca < 0.01%, Si < 0.10% |
100 kg 1000kg Customize |
Comparison of Boron Nitride Ceramics
| Grade | BN-BO | BN-SZ | BN-AlN |
| Compositions | BN>98% | BN+SiC+ZrO2 | BN+AIN |
| Binder | B2O3 | / | AlBO3 |
| Density | 2.1-2.2 g/cm3 | 2.3-3.0 g/cm3 | 2.5-2.6 g/cm3 |
| 25°C Volume Resistivity | >1013 Ω·cm | >1012 Ω·cm | >1014 Ω·cm |
| Max. Service Temp. (°C) Oxygen; Inert Gas; High Vacuum |
900 2000 1800 |
900 1700 1700 |
900 2100 1900 |
| Flexural Strength | 75 Mpa | 100 Mpa | 130 Mpa |
| Compressive Strength | 100 Mpa | 300 Mpa | 250 Mpa |
| Coefficient of Thermal Expansion 25-1000°C |
2.0 x 10–6/K | 4.0 x 10–6/K | 4.5 x 10–6/K |
| Thermal Conductivity | 30 W/mK | 40 W/mK | 60 W/mK |
HBN Film Specification
| Type | Substrate: copper foil. |
| Size (mm) | 5*10, 10*10, 10*20 |
| Crystal Structure | Hexagonal Phase |
| Method | Chemical Vapor Deposition (CVD) |
HBN Film Applications
* Plasma arc welding applications
* Semiconductor crystal growth equipment and processing
Packaging
We handle our products with care to ensure they remain in their original condition during storage and transportation and to preserve their quality.
