Sputtering Targets

Sputtering Targets Review

Sputtering process is vacuum evaporation by physically removes portions of a coating material called the target, and deposits a thin, firmly bonded film onto an adjacent surface called the substrate. The process occurs by bombarding the surface of the sputtering target with gaseous ions under high voltage acceleration. As these ions collide with the target, atoms or occasionally entire molecules of the target material are ejected and propelled against the substrate, where they form a very tight bond.

CG’s Sputtering Materials

CG offers sputtering targets made up of many different element’s and/or alloys as well as in numerous other forms and purities; up to 6N (99.9999%). They are available forms include Discs, Plates, Column Targets, Step Targets, Custom-made.

1, Pure Metal Targets

2, Compound Sputtering Targets

Oxide Sputtering targets

Boride Sputtering Targets

Carbide Sputtering Targets

Fluoride Sputtering Targets

Nitride Sputtering Targets

Silicide Sputtering Targets

Tellurides Sputtering Targets

Antimonide Sputtering Targets

Arsenide Sputtering Targets

Others

3, Alloy Targets

Aluminium based alloy

Chromium based alloy

Cobalt based alloy

Gold based alloy

Hastelloy based alloy

Indium oxide based alloy

Iron based alloy

Molybdenum based alloy

Nickel based alloy

Tantalum based alloy

Titanium based alloy

Zirconium based alloy

4, Rotatable targets

Rotatable target technology is used in large area coating manufacturing of architectural glass and flat panel displays.

Complementing our advanced thermal spray capability, CG materials has developed proprietary casting capability to manufacture select rotatable sputtering targets to meet high density and high purity specifications.