Sputtering Targets
Sputtering Targets Review
Sputtering process is vacuum evaporation by physically removes portions of a coating material called the target, and deposits a thin, firmly bonded film onto an adjacent surface called the substrate. The process occurs by bombarding the surface of the sputtering target with gaseous ions under high voltage acceleration. As these ions collide with the target, atoms or occasionally entire molecules of the target material are ejected and propelled against the substrate, where they form a very tight bond.
CG’s Sputtering Materials
CG offers sputtering targets made up of many different element’s and/or alloys as well as in numerous other forms and purities; up to 6N (99.9999%). They are available forms include Discs, Plates, Column Targets, Step Targets, Custom-made.
1, Pure Metal Targets
B |
Mg |
Al |
Si |
Ti |
Co |
Ni |
Cu |
Zn |
Ga |
Ge |
Y |
Zr |
Nb |
Mo |
Ru |
Rh |
Pd |
Ag |
In |
Sn |
Hf |
Ta |
W |
Ir |
Pt |
Au |
2, Compound Sputtering Targets
Oxide Sputtering targets
Boride Sputtering Targets
Carbide Sputtering Targets
Fluoride Sputtering Targets
Nitride Sputtering Targets
Silicide Sputtering Targets
Tellurides Sputtering Targets
Antimonide Sputtering Targets
Arsenide Sputtering Targets
Others
3, Alloy Targets
Aluminium based alloy
Chromium based alloy
Cobalt based alloy
Gold based alloy
Hastelloy based alloy
Indium oxide based alloy
Iron based alloy
Molybdenum based alloy
Nickel based alloy
Tantalum based alloy
Titanium based alloy
Zirconium based alloy
4, Rotatable targets
Rotatable target technology is used in large area coating manufacturing of architectural glass and flat panel displays.
Complementing our advanced thermal spray capability, CG materials has developed proprietary casting capability to manufacture select rotatable sputtering targets to meet high density and high purity specifications.